Additive manufacturing of pure copper using ultrashort laser pulses

Lisa Kaden; Gabor Matthäus; Roland Ramm; Tobias Ullsperger; Brian Seyfarth; Stefan Nolte

doi:10.1117/12.2507401

4 March 2019 Additive manufacturing of pure copper using ultrashort laser pulses

Lisa Kaden, Gabor Matthäus, Roland Ramm, Tobias Ullsperger, Brian Seyfarth, Stefan Nolte

Proceedings Volume 10909, Laser 3D Manufacturing VI; 109090D (2019) https://doi.org/10.1117/12.2507401
Event: SPIE LASE, 2019, San Francisco, California, United States

Abstract

Here we present laser aided additive manufacturing of pure copper parts using ultrashort laser pulses. The process is based on the powder bed fusion of pure copper powder with grain sizes in the range of 5 μm – 15 μm. For processing, a fiber laser system delivering 500 fs pulses at a wavelengths of 515 nm was used. Robust 3D printed parts are generated featuring a high degree of resolution. The fabricated copper samples were characterized in terms of morphology, density distribution, thermal and electrical conductivity. The inner structure is revealed by x-ray computed tomography measurements.

Citation Download Citation

Lisa Kaden, Gabor Matthäus, Roland Ramm, Tobias Ullsperger, Brian Seyfarth, and Stefan Nolte "Additive manufacturing of pure copper using ultrashort laser pulses", Proc. SPIE 10909, Laser 3D Manufacturing VI, 109090D (4 March 2019); https://doi.org/10.1117/12.2507401

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available