Distribution characteristics of subsurface damage induced by different machining methods of fused silica

Xiaoqiang Zhang; Xuefu Song; Yuancheng Sun; Xiurong Du; Chenyang Zhang; Chengkui Zu

doi:10.1117/12.2580160

5 November 2020 Distribution characteristics of subsurface damage induced by different machining methods of fused silica

Xiaoqiang Zhang, Xuefu Song, Yuancheng Sun, Xiurong Du, Chenyang Zhang, Chengkui Zu

Author Affiliations +

Proceedings Volume 11568, AOPC 2020: Optics Ultra Precision Manufacturing and Testing; 115681K (2020) https://doi.org/10.1117/12.2580160
Event: Applied Optics and Photonics China (AOPC 2020), 2020, Beijing, China

Abstract

To investigate the distribution characteristics of subsurface damage in fused silica, three different machining methods - cutting, grinding and lapping were adopted. The method of combination of step-by-step polishing and wet etching were applied to expose the subsurface damage and their distribution characteristics in horizontal and vertical directions were analyzed and compared. Experiment results showed that the numbers of subsurface cracks induced by different processes have similar exponential distribution in depth, although their maximum depths were varied with machining methods. Most of the cracks, more than 90%, distribute within half of the maximum crack depth, while only a few cracks extend deeper and contribute the maximum SSD depth. The ratio of SSD depth to Rz for lapping, slicing and grinding based on our work are about 1.4, 1.8 and 2.8, respectively. The present results indicate a nonlinear correlation between SSD depth and Rz.

Citation Download Citation

Xiaoqiang Zhang, Xuefu Song, Yuancheng Sun, Xiurong Du, Chenyang Zhang, and Chengkui Zu "Distribution characteristics of subsurface damage induced by different machining methods of fused silica", Proc. SPIE 11568, AOPC 2020: Optics Ultra Precision Manufacturing and Testing, 115681K (5 November 2020); https://doi.org/10.1117/12.2580160

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