Presentation + Paper
4 March 2022 Nanosecond laser-assisted hybrid micro-scribing based fabrication of frequency selective surface
Author Affiliations +
Abstract
Micro-scale removal of Cu from a dielectric substrate has applications in microelectronics, patch antenna fabrication and frequency selective surface (FSS) manufacturing. Pulsed laser-based micro-scribing of Copper (Cu) from a dielectric is a preferred technique to avoid the adverse effects of chemical etching, such as toxicity and corrosive nature of the etchant, difficulty in fabrication of mask etc. However, pulsed laser-assisted removal of Cu from a dielectric in the air will produce recast layer/ redeposit, oxide layer near the ablation zone and thermal damage to the dielectric is another challenge. In this study, a hybrid technique with nanosecond laser-activated electrochemical micro-scribing of Cu is demonstrated. The technique was extended to remove 35 μm Cu from Rogers-RO4003 dielectric with a thickness ≈0.75 mm to fabricate FSS samples in X-band. The Cu-deposited dielectric substrate was immersed in Sodium Chloride (NaCl) solution, the laser beam was directed through a negatively biased tool electrode and the sample was biased positively. In this hybrid technique, along with laser-assisted material removal, laser-activated electrochemical etching also removed Cu selectively. The laser irradiation coupled with the NaCl solution induced preferential micro-etching, resulting in improved surface morphology without re-deposition and recast layer and thermal protection to the dielectric substrate. The FSS sample produced with the laser-hybrid micro-scribing was working at 10.3 GHz.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sooraj Shiby, Yugandhara R. Yadam, Balamurugan T. Sivaprakasam, Kavitha Arunachalam, and Nilesh J. Vasa "Nanosecond laser-assisted hybrid micro-scribing based fabrication of frequency selective surface", Proc. SPIE 11989, Laser-based Micro- and Nanoprocessing XVI, 119890T (4 March 2022); https://doi.org/10.1117/12.2609855
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KEYWORDS
Copper

Dielectrics

Laser ablation

Pulsed laser operation

Electrodes

Fabrication

Ions

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