Defect analysis and classification in process control using an SEM and EDX review station

Pascal Perret; Vincent Zinssner

doi:10.1117/12.250842

12 September 1996 Defect analysis and classification in process control using an SEM and EDX review station

Pascal Perret, Vincent Zinssner

Proceedings Volume 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II; (1996) https://doi.org/10.1117/12.250842
Event: Microelectronic Manufacturing 1996, 1996, Austin, TX, United States

Abstract

For process control and yield improvement, in-line inspection and defect review are required in the semiconductor industry. In order to monitor the process and be able to identify and solve any production related problems, the review must use a precise defect classification. For effective classification, the defects must first of all be analyzed and identified and the defect classes created. Defect characterization can be performed using different kinds of tools: optical microscope, electron microscope with x-ray analysis and others. In-line review and classification are mainly achieved using optical systems because of their throughput. However this technique is not efficient enough for advanced technologies. Scanning electron microscopy with EDX analysis must be used in order to accurately determine the defect classes. The SEM resolution, type of image contrast and the possibility of performing chemical analyses using the EDX system can lead to a change in the classification, set up by optical review. Defect characterizations are presented and on some examples the limitations of optical classification and the interest of SEM and EDX analyses in determining the defect classes are highlighted.

Citation Download Citation

Pascal Perret and Vincent Zinssner "Defect analysis and classification in process control using an SEM and EDX review station", Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); https://doi.org/10.1117/12.250842

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