Paper
8 October 2004 Application of laser direct-write techniques for embedding electronic and micropower components
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Proceedings Volume 5662, Fifth International Symposium on Laser Precision Microfabrication; (2004) https://doi.org/10.1117/12.596562
Event: Fifth International Symposium on Laser Precision Microfabrication, 2004, Nara, Japan
Abstract
Significant reduction in weight and volume for a given circuit design can be obtained by embedding the required surface mount devices, bare die and power source elements into the circuit board. In addition, embedded structures allow for improved electrical performance and enhanced function integration within traditional circuit board substrates and non-traditional surfaces such as the external case. Laser-based direct-write techniques can be used for developing such embedded structures at a fraction of the cost and in less time that it would take to develop system-on-chip alternatives such as ASIC's. Laser micromachining has been used in the past to machine vias and trenches on circuit board substrates with great precision, while laser forward transfer has been used to deposit patterns and multilayers of various electronic materials. This paper describes recent work performed at the Naval Research Laboratory using the above laser direct-write techniques to machine the surface and deposit the materials required to embed, connect and encapsulate individual electronic components and microbatteries inside a plastic substrate.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alberto Pique, Scott A. Mathews, Raymond C. Auyeung, Michael Ollinger, Heungsoo Kim, Bhanu Pratap, Craig B. Arnold, and Thomas E. Sutto "Application of laser direct-write techniques for embedding electronic and micropower components", Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); https://doi.org/10.1117/12.596562
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Cited by 12 scholarly publications.
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KEYWORDS
Electronic components

Micromachining

Electrodes

Nonimpact printing

Capacitors

Resistors

Semiconductors

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