High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes

Che-Hsuan Huang; Kuo-Ju Chen; Ming-Ta Tsai; Min-Hsiung Shih; Chia-Wei Sun; Wei-I Lee; Chien-Chung Lin; Hao-Chung Kuo

doi:10.1117/1.JPE.5.057606

21 April 2015 High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes

Che-Hsuan Huang, Kuo-Ju Chen, Ming-Ta Tsai, Min-Hsiung Shih, Chia-Wei Sun, Wei-I Lee, Chien-Chung Lin, Hao-Chung Kuo

Author Affiliations +

Journal of Photonics for Energy, Vol. 5, Issue 1, 057606 (April 2015). https://doi.org/10.1117/1.JPE.5.057606

Abstract

This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications.

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Che-Hsuan Huang, Kuo-Ju Chen, Ming-Ta Tsai, Min-Hsiung Shih, Chia-Wei Sun, Wei-I Lee, Chien-Chung Lin, and Hao-Chung Kuo "High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes," Journal of Photonics for Energy 5(1), 057606 (21 April 2015). https://doi.org/10.1117/1.JPE.5.057606

Published: 21 April 2015

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