Optical sensor for semiconductor chip bonding

Tuck Wah Ng; C.W. Ng

doi:10.1117/1.1625379

1 December 2003 Optical sensor for semiconductor chip bonding

Tuck Wah Ng, C.W. Ng

Author Affiliations +

Optical Engineering, Vol. 42, Issue 12, (December 2003). https://doi.org/10.1117/1.1625379

Abstract

A through-beam configuration optical sensor is designed, fabricated, and tested for chip bonding. The tip taper angle was designed based on a cone condensor theory for maximal optical power collection at the tip's output. Experiments conducted to determine the optical power collected using a series of tip taper angles confirm the general applicability of the cone condenser theorem. The optical sensor was found to perform extremely well when incorporated in an actual chip bonding machine, where chips of 3.4×3.4 mm in dimension were tested.

©(2003) Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation Download Citation

Tuck Wah Ng and C.W. Ng "Optical sensor for semiconductor chip bonding," Optical Engineering 42(12), (1 December 2003). https://doi.org/10.1117/1.1625379

Published: 1 December 2003

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