Presentation
13 June 2022 A holistic study of edge placement error on fin cut layer in self-aligned double patterning process
Author Affiliations +
Abstract
This Conference Presentation, “A holistic study of edge placement error on fin cut layer in self-aligned double patterning process,” was recorded at SPIE Photonics West held in San Francisco, California, United States.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yuyang Bian, Biqiu Liu, Xijun Guan, Xiaobo Guo, Cong Zhang, Wenzhan Zhou, Jun Huang, Yu Zhang, Jiawang Song, Yang Gao, Shmuel Nissim, Kevin Houchens, Omri Baum, Qiang Zhou, Zaisan Yang, Amit Zakay, Tal Ayzik, and Yaniv Abramovitz "A holistic study of edge placement error on fin cut layer in self-aligned double patterning process", Proc. SPIE PC12053, Metrology, Inspection, and Process Control XXXVI, PC120530D (13 June 2022); https://doi.org/10.1117/12.2614221
Advertisement
Advertisement
KEYWORDS
Double patterning technology

Overlay metrology

Edge roughness

Critical dimension metrology

Electron microscopy

Integrated circuits

Line edge roughness

Back to Top