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30 April 2023 Plasma etch challenges and innovations to enable sub-26nm pitch L/S patterning with high-NA EUV
Nafees A. Kabir
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Proceedings Volume PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII; PC124990G (2023) https://doi.org/10.1117/12.2658512
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States
Abstract
This conference presentation was prepared for the Advanced Etch Technology and Process Integration for Nanopatterning XII conference at SPIE Advanced Lithography + Patterning 2023.
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© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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Nafees A. Kabir "Plasma etch challenges and innovations to enable sub-26nm pitch L/S patterning with high-NA EUV", Proc. SPIE PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, PC124990G (30 April 2023); https://doi.org/10.1117/12.2658512
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KEYWORDS
Plasma etching
Optical lithography
Etching
Plasma
Extreme ultraviolet
Logic
Extreme ultraviolet lithography
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