Paper
25 August 1987 An Improved Technique For 1/4 Micrometer Gate Length Gaas Mesfet Fabrication By Optical Lithography
Brad D. Cantos, Ronald D. Remba
Author Affiliations +
Abstract
This paper describes an innovative photolithographic method for the fabrication of 1/4 micrometer gates in gallium arsenide Metal-Semiconductor Field Effect Transistors (GaAs MESFETs). The method utilizes image reversal technology, in which negative polarity images are produced in positive diazide photoresists. This work describes improvements obtained using ammonia as the image reversal catalyst over work previously described which used imidazole [1]. The ammonia based image reversal process is characterized with respect to sensitivity to several process parameters and uniformity of the resultant linewidth. The linewidth uniformity attained using this process is ± 0.03 micrometer over a 50 mm diameter wafer and is currently used to fabricate 1/4 micrometer gate MESFETs on gallium arsenide.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Brad D. Cantos and Ronald D. Remba "An Improved Technique For 1/4 Micrometer Gate Length Gaas Mesfet Fabrication By Optical Lithography", Proc. SPIE 0771, Advances in Resist Technology and Processing IV, (25 August 1987); https://doi.org/10.1117/12.940342
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications and 1 patent.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Image processing

Semiconducting wafers

Photomasks

Metals

Gallium arsenide

Photoresist materials

Floods

Back to Top