Simulation Of Thermal Characteristics Of Substrates

Nashwa M. Shaalan; Ashraf H. Yahia

doi:10.1117/12.941630

6 October 1987 Simulation Of Thermal Characteristics Of Substrates

Nashwa M. Shaalan, Ashraf H. Yahia

Proceedings Volume 0812, Progress in Holography; (1987) https://doi.org/10.1117/12.941630
Event: Fourth International Symposium on Optical and Optoelectronic Applied Sciences and Engineering, 1987, The Hague, Netherlands

Abstract

Different computational techniques were used to simulate thermal characteristics of nodal points on substrate chips. Multiple distributed thermal disturbances were investigated through thermal resistance calculations among the substrate surface. The simulated results for multiple heat sources are similar to those experimented.

Citation Download Citation

Nashwa M. Shaalan and Ashraf H. Yahia "Simulation Of Thermal Characteristics Of Substrates", Proc. SPIE 0812, Progress in Holography, (6 October 1987); https://doi.org/10.1117/12.941630

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