Laser Packaging For Very High Speed Lightwave Systems

J. Lipson; W. R. Holbrook; N. R. Dietrich; W. L. Emkey; R. S. Tucker; A. H. Gnauck; G. Eisenstein; C. A. Burrus; N. K. Dutta

doi:10.1117/12.960103

9 February 1989 Laser Packaging For Very High Speed Lightwave Systems

J. Lipson, W. R. Holbrook, N. R. Dietrich, W. L. Emkey, R. S. Tucker, A. H. Gnauck, G. Eisenstein, C. A. Burrus, N. K. Dutta

Author Affiliations +

Proceedings Volume 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II; (1989) https://doi.org/10.1117/12.960103
Event: O-E/Fiber LASE '88, 1988, Boston, MA, United States

Abstract

Laser modules with broadband characteristics are required in multi-gigabit/s lightwave systems and in some analog applications. In addition, optical isolation is necessary to prevent spectral instabilities and enhanced intensity noise arising from optical reflections. We report here on fully packaged 1.3 micron distributed feedback lasers, having a bandwidth in excess of 9 GHz, and modulation capability to 8 Gb/s. When operated directly into an InGaAs APD, receiver sensitivities as low as -25.2 dBm have been obtained at a bit error rate of 10-9. We also report on techniques for providing optical isolation both internal and external to the laser module. Peak isolation > 60 dB and > 35 dB has been achieved respectively in these two applications.

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J. Lipson, W. R. Holbrook, N. R. Dietrich, W. L. Emkey, R. S. Tucker, A. H. Gnauck, G. Eisenstein, C. A. Burrus, and N. K. Dutta "Laser Packaging For Very High Speed Lightwave Systems", Proc. SPIE 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II, (9 February 1989); https://doi.org/10.1117/12.960103

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