Investigation of electroless Ni(P)/Pd/Au metallization for solder joining of optical assemblies using laser-based solderjet bumping

Thomas Burkhardt; Max Mäusezahl; Marcel Hornaff; Oliver de Vries; Jan Kinast; Christoph Damm; Erik Beckert

doi:10.1117/12.2254752

22 February 2017 Investigation of electroless Ni(P)/Pd/Au metallization for solder joining of optical assemblies using laser-based solderjet bumping

Thomas Burkhardt, Max Mäusezahl, Marcel Hornaff, Oliver de Vries, Jan Kinast, Christoph Damm, Erik Beckert

Author Affiliations +

Proceedings Volume 10097, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VI; 100970D (2017) https://doi.org/10.1117/12.2254752
Event: SPIE LASE, 2017, San Francisco, California, United States

Abstract

Solder joining is an all inorganic, adhesive free bonding technique for optical components and support structures of advanced optical systems. We established laser-based Solderjet Bumping for mounting and joining of elements with highest accuracies and stability. It has been proven for optical assemblies operating under harsh environmental conditions, high energetic or ionizing radiation, and for vacuum operation. Spaceborne instrumentation experiencing such conditions and can benefit from inorganic joining to avoid adhesives and optical cements. The metallization of components, necessary to provide solder wetting, mainly relies on well-adhering layer systems provided by physical vapor deposition (PVD). We present the investigation of electroless Ni(P)/Pd/Au plating as a cost-efficient alternative under bump metallization of complex or large components unsuitable for commercially available PVD. The electroless Ni(P)/Pd/Au plating is characterized with respect to layer adherence, solderability, and bond strength using SnAg3Cu0.5 lead-free solder alloy.

Conference Presentation

Citation Download Citation

Thomas Burkhardt, Max Mäusezahl, Marcel Hornaff, Oliver de Vries, Jan Kinast, Christoph Damm, and Erik Beckert "Investigation of electroless Ni(P)/Pd/Au metallization for solder joining of optical assemblies using laser-based solderjet bumping", Proc. SPIE 10097, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VI, 100970D (22 February 2017); https://doi.org/10.1117/12.2254752

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE