Presentation + Paper
24 March 2017 Single exposure EUV patterning of BEOL metal layers on the IMEC iN7 platform
Author Affiliations +
Abstract
This paper summarizes findings on the iN7 platform (foundry N5 equivalent) for single exposure EUV (SE EUV) of M1 and M2 BEOL layers. Logic structures within these layers have been measured after litho and after etch, and variability was characterized both with conventional CD-SEM measurements as well as Hitachi contouring method. After analyzing the patterning of these layers, the impact of variability on potential interconnect reliability was studied by using MonteCarlo and process emulation simulations to determine if current litho/etch performance would meet success criteria for the given platform design rules.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
V. M. Blanco Carballo, J. Bekaert, M. Mao, B. Kutrzeba Kotowska, S. Larivière, I. Ciofi, R. Baert, R. H. Kim, E. Gallagher, E. Hendrickx, L. E. Tan, W. Gillijns, D. Trivkovic, P. Leray, S. Halder, M. Gallagher, F. Lazzarino, S. Paolillo, D. Wan, A. Mallik, Y. Sherazi, G. McIntyre, M. Dusa, P. Rusu, T. Hollink, T. Fliervoet, and F. Wittebrood "Single exposure EUV patterning of BEOL metal layers on the IMEC iN7 platform", Proc. SPIE 10143, Extreme Ultraviolet (EUV) Lithography VIII, 1014318 (24 March 2017); https://doi.org/10.1117/12.2258005
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Cited by 5 scholarly publications.
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KEYWORDS
Extreme ultraviolet

Etching

Metals

Optical lithography

Extreme ultraviolet lithography

Back end of line

Semiconducting wafers

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