Characterization of Automated Wafer Inspection Tools

Rick Wallace; Gary Dickerson

doi:10.1117/12.953091

19 July 1989 Characterization of Automated Wafer Inspection Tools

Rick Wallace, Gary Dickerson

Proceedings Volume 1087, Integrated Circuit Metrology, Inspection, and Process Control III; (1989) https://doi.org/10.1117/12.953091
Event: 1989 Santa Clara Symposium on Microlithography, 1989, San Jose, CA, United States

Abstract

With some companies now ramping up production of the 4 Mbit DRAM, the era of submicron device technology has begun. To produce each new device with an acceptable yield, there is a requirement for a decrease in defect density in comparison to previous generations of technology as shown in the figure 1.

Citation Download Citation

Rick Wallace and Gary Dickerson "Characterization of Automated Wafer Inspection Tools", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); https://doi.org/10.1117/12.953091

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