Combining Electrical Defect Monitors with Automatic Visual Inspection Systems

Christopher W. Teutsch; David C. Drain

doi:10.1117/12.953092

19 July 1989 Combining Electrical Defect Monitors with Automatic Visual Inspection Systems

Christopher W. Teutsch, David C. Drain

Proceedings Volume 1087, Integrated Circuit Metrology, Inspection, and Process Control III; (1989) https://doi.org/10.1117/12.953092
Event: 1989 Santa Clara Symposium on Microlithography, 1989, San Jose, CA, United States

Abstract

As defect densities decrease, ever increasing sample areas will be required for statistically valid estimates of defect densities. Several tools exist, such as electrical defect monitors (serpentines and combs), that can test a large area but provide little information about the defects detected. At the same time, automated visual inspection techniques (KLA 2028) exist that inspect smaller areas with greater detail. We propose a strategy for analyzing large areas with great detail by combining both of these tools. The necessity of obtaining visual information for process evaluations is discussed. Experimental results are described in support of this strategy.

Citation Download Citation

Christopher W. Teutsch and David C. Drain "Combining Electrical Defect Monitors with Automatic Visual Inspection Systems", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); https://doi.org/10.1117/12.953092

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