Electrically measurable test structures to capture and classify EUV stochastics

Hemant Vats; Ryan Ryoung Han Kim; Yasser Sherazi; Youssef Drissi; Kurt Ronse

doi:10.1117/12.2515418

4 June 2019 Electrically measurable test structures to capture and classify EUV stochastics

Hemant Vats, Ryan Ryoung Han Kim, Yasser Sherazi, Youssef Drissi, Kurt Ronse

Author Affiliations +

Proceedings Volume 10957, Extreme Ultraviolet (EUV) Lithography X; 109571M (2019) https://doi.org/10.1117/12.2515418
Event: SPIE Advanced Lithography, 2019, San Jose, California, United States

Abstract

Advanced technology nodes are demanding aggressive printability using EUV. EUV printing process inherently brings in stochastic defects. To measure and experience various types of Stochastics in EUV printing, high volume measurements are deemed necessary. Furthermore the classification of the defects in terms of stochastic and systematic is also required. The permutation and combinations of shapes, sizes, and proximity driven stochastics errors are high in numbers, leading to significant increase in the number of test structures needed. Without electrically measurable solutions, the defect test measurement exercise becomes impractical to perform visually. This paper will describe few examples of developing and handling the test structures capable to capture the defects and defect location and further to classify the defects in terms of stochastic or systematic defects.

Citation Download Citation

Hemant Vats, Ryan Ryoung Han Kim, Yasser Sherazi, Youssef Drissi, and Kurt Ronse "Electrically measurable test structures to capture and classify EUV stochastics", Proc. SPIE 10957, Extreme Ultraviolet (EUV) Lithography X, 109571M (4 June 2019); https://doi.org/10.1117/12.2515418

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