Presentation + Paper
29 March 2019 What is prevalent CD-SEM's role in EUV era?
Author Affiliations +
Abstract
As industry prepares to introduce extreme ultraviolet (EUV) technology for the coming sub-10-nm lithography, this paper presents metrology approaches that utilize the prevalent Critical Dimension Scanning Electron Microscope (CD-SEM). Two technical approaches will be discussed. One is comprehensive solutions for new EUV characterized features, such as low resist-shrinkage electron beam optics and high efficiency metrology/inspection for EUV process monitoring. The other, like conventional minimization processes, is down-to-ångström-order metrology methodologies required for stricter CD process control. This paper is the first to conceptualize specifications for a stringent and multi-index tool matching, namely “atomic matching,” which is considered as a crucially important feature of any in-line metrology tools in the EUV era.
Conference Presentation
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhigang Wang, Yoshinori Momonoi, Katsumi Setoguchi, Makoto Suzuki, and Satoru Yamaguchi "What is prevalent CD-SEM's role in EUV era?", Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 1095914 (29 March 2019); https://doi.org/10.1117/12.2514697
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Cited by 1 scholarly publication.
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KEYWORDS
Metrology

Extreme ultraviolet

Image processing

Stochastic processes

Scanning electron microscopy

Semiconducting wafers

Extreme ultraviolet lithography

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