Presentation + Paper
2 March 2020 Micro laser assisted single point diamond turning of brittle and hard materials
Hossein Shahinian, Jayesh Navare, Charan Bodlapati, Dmytro Zaytsev, Di Kang, Deepak Ravindra
Author Affiliations +
Abstract
This article summarizes laser assisted single point diamond turning (SPDT) of select brittle and hard materials, using the μ-LAM process. These materials all have significant industrial importance in the modern day. It is shown that the μ-LAM process can produce smooth surfaces, with roughness values range from 40 nm RMS down to subnanometer RMS.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hossein Shahinian, Jayesh Navare, Charan Bodlapati, Dmytro Zaytsev, Di Kang, and Deepak Ravindra "Micro laser assisted single point diamond turning of brittle and hard materials", Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 112670Z (2 March 2020); https://doi.org/10.1117/12.2547009
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KEYWORDS
Glasses

Single point diamond turning

Diamond

Laser cutting

Silicon

Germanium

Silica

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