Performance, manufacturability, and qualification advances of high-power VCSEL arrays at TriLumina Corporation

Thomas R. Fanning; John Maynard; Christopher J. Helms; Lei Yang; David Podva; Jeff Earls; Jacob Lopez; Michael Chung; James Foresi; Mial E. Warren; Gianluca Bacchin

doi:10.1117/12.2546689

24 February 2020 Performance, manufacturability, and qualification advances of high-power VCSEL arrays at TriLumina Corporation

Thomas R. Fanning, John Maynard, Christopher J. Helms, Lei Yang, David Podva, Jeff Earls, Jacob Lopez, Michael Chung, James Foresi, Mial E. Warren, Gianluca Bacchin

Author Affiliations +

Proceedings Volume 11300, Vertical-Cavity Surface-Emitting Lasers XXIV; 1130002 (2020) https://doi.org/10.1117/12.2546689
Event: SPIE OPTO, 2020, San Francisco, California, United States

Abstract

TriLumina develops and manufactures flip-chip VCSEL technology used in 3D sensing applications that must meet automotive grade 1 temperature range (-40˚C to 125˚C) performance and be tested to high reliability standards and criteria (AEC-Q102). Advances in VCSEL efficiency, performance and automotive qualification of TriLumina’s selfhermetic flip-chip VCSEL are discussed. TriLumina’s VCSEL-on-board (VoB), surface-mount technology VCSEL is introduced.

Citation Download Citation

Thomas R. Fanning, John Maynard, Christopher J. Helms, Lei Yang, David Podva, Jeff Earls, Jacob Lopez, Michael Chung, James Foresi, Mial E. Warren, and Gianluca Bacchin "Performance, manufacturability, and qualification advances of high-power VCSEL arrays at TriLumina Corporation", Proc. SPIE 11300, Vertical-Cavity Surface-Emitting Lasers XXIV, 1130002 (24 February 2020); https://doi.org/10.1117/12.2546689

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