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9 March 2020 Deep UV LED modules: highly efficient and reliable package concepts (Conference Presentation)
Frank Gindele, Alexander Neumeier, Christian Rakobrandt
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Proceedings Volume 11302, Light-Emitting Devices, Materials, and Applications XXIV; 113021E (2020) https://doi.org/10.1117/12.2548090
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
The predicted progress and enhanced performance of UVC LED modules requires both an increased efficiency of the LED dies along with design and implementation of highly reliable and innovative package technology concepts. This includes the need for outstanding thermal conductivity, the use of non-aging materials that withstand UVC radiation, low optical losses, optics that are highly transparent for UVC radiation and useable for beam shaping, and the ability to enable reliable performance in harsh environmental conditions by implementing hermetic protection of the die. Hermetic package components from SCHOTT use proven Glass-to-Metal Sealing (GTMS) and Ceramic-to-Metal Sealing (CerTMS®) technology, offering a suitable package solution for UV LED modules. Longevity and reliability tests show clear advantages in comparison to polymer-based modules. In addition, the outcoupling efficiency can be significantly increased by using high-transmission SCHOTT Deep UV as encapsulation material
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Frank Gindele, Alexander Neumeier, and Christian Rakobrandt "Deep UV LED modules: highly efficient and reliable package concepts (Conference Presentation)", Proc. SPIE 11302, Light-Emitting Devices, Materials, and Applications XXIV, 113021E (9 March 2020); https://doi.org/10.1117/12.2548090
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KEYWORDS
Light emitting diodes
Deep ultraviolet
Thermography
Beam shaping
Ceramics
Polymers
Reliability
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