CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 11673 > Article
Presentation
5 March 2021 Micro-via fabrication of glass material for semiconductor packaging by 248 nm excimer laser
Yasufumi Kawasuji, Akira Suwa, Yasuhiro Adachi, Masakazu Kobayashi, Kouji Kakizaki, Masakazu Washio
Author Affiliations +
Proceedings Volume 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI; 116730E (2021) https://doi.org/10.1117/12.2578038
Event: SPIE LASE, 2021, Online Only
Abstract
In this study, we are developing the process of glass ablation by 248nm excimer to make micro-via to the glass material. The interposer connects many pins between both sides electrically. Therefore, the micro-via to the glass substrate must be needed.　However, the micro-via machining to the glass material is difficult because the glass is brittle material. We report microdrilling processability of less than 20um diameter for glass material using a 248nm excimer laser. We also report the investigation result of the dependence of the drilling rate and laser fluence and laser pulse width.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Yasufumi Kawasuji, Akira Suwa, Yasuhiro Adachi, Masakazu Kobayashi, Kouji Kakizaki, and Masakazu Washio "Micro-via fabrication of glass material for semiconductor packaging by 248 nm excimer laser", Proc. SPIE 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI, 116730E (5 March 2021); https://doi.org/10.1117/12.2578038
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 PRESENTATION
WATCH
PRESENTATION SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
KEYWORDS
Glasses
Semiconductors
Excimer lasers
Packaging
Semiconductor materials
Semiconducting wafers
Laser drilling
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top