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5 March 2021 Asymmetrical Bessel beam dicing versus conventional glass processing techniques
Juozas Dudutis, Jokūbas Pipiras, Paulius Gecys
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Proceedings Volume 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI; 116730F (2021) https://doi.org/10.1117/12.2574841
Event: SPIE LASE, 2021, Online Only
Abstract
In this work, we will introduce the Bessel beam asymmetry control for glass dicing applications. Asymmetrical Bessel beam can be used to form modifications inside the glass with dominant crack propagation direction optimizing the dicing speed and sample separation forces. The Bessel beam asymmetry control will be demonstrated by applying axicon tilt operations and other approaches including the beam shaping with amplitude masks. Further, the Bessel beam dicing process will be compared to conventional processing techniques such as mechanical dicing (score and brake method), diamond saw and water jet cutting.
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Juozas Dudutis, Jokūbas Pipiras, and Paulius Gecys "Asymmetrical Bessel beam dicing versus conventional glass processing techniques", Proc. SPIE 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI, 116730F (5 March 2021); https://doi.org/10.1117/12.2574841
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KEYWORDS
Bessel beams
Glass processing
Glasses
Laser cutting
Axicons
Beam controllers
Laser applications
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