High efficiency and high power density VCSEL chip for 3D sensing

Yao Xiao; Shaoyang Tan; Jun Wang; Heng Liu

doi:10.1117/12.2578024

5 March 2021 High efficiency and high power density VCSEL chip for 3D sensing

Yao Xiao, Shaoyang Tan, Jun Wang, Heng Liu

Proceedings Volume 11704, Vertical-Cavity Surface-Emitting Lasers XXV; 1170407 (2021) https://doi.org/10.1117/12.2578024
Event: SPIE OPTO, 2021, Online Only

Abstract

Vertical cavity surface emitting laser (VCSEL) have recently emerged as highly promising electro optic device in 3D sensing and Lidar due to excellent properties such as high reliability, attractive high power performance, design flexibility and low manufacturing costs. To become a dominant player in serving the consumer electronics and driverless cars markets, we develop 6-inch VCSEL production line include device design, epitaxial growth and device-fabrication. By optimizing the device structure and manufacturing process, high power and high efficiency VCSEL devices are developed. We demonstrate that the maximum power conversion efficiency of the triple active regions VCSEL with 61.6%. In this paper, we will present you the evolution of VCSEL manufacturing technology and device characterization.

Conference Presentation

Citation Download Citation

Yao Xiao, Shaoyang Tan, Jun Wang, and Heng Liu "High efficiency and high power density VCSEL chip for 3D sensing", Proc. SPIE 11704, Vertical-Cavity Surface-Emitting Lasers XXV, 1170407 (5 March 2021); https://doi.org/10.1117/12.2578024

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