Volumetric microfabrication of helical structures for industrial applications

He Cheng; Pooria Golvari; Chun Xia; Mingman Sun; Meng Zhang; Stephen M. Kuebler; Xiaoming Yu

doi:10.1117/12.2614703

25 May 2022 Volumetric microfabrication of helical structures for industrial applications

He Cheng, Pooria Golvari, Chun Xia, Mingman Sun, Meng Zhang, Stephen M. Kuebler, Xiaoming Yu

Proceedings Volume 12054, Novel Patterning Technologies 2022; 1205409 (2022) https://doi.org/10.1117/12.2614703
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States

Abstract

Helical structures with novel optical and mechanical properties have been demonstrated and are commonly used in different fields such as metamaterials, microfluidics and cell scaffold. None of conventional fabrication methods has the throughput or flexibility required for patterning large surface area with tunable pitch. In this paper, we report a novel method for high-throughput volumetric fabricating helical structures with tunable shape based on multiphoton polymerization (MPP) using single-exposure, self-accelerating beam with adjustable rotating intensity profile. The lightfields are generated based on high-order Bessel modes and an analytical model is derived to describe the generation and propagation of light-fields. The method is used to fabricated micro-helices with different pitches and handedness in SU-8 photoresist. Beam splitting and galvo-scanning can be implemented in the system. The fabrication of large-scale helical matrices is demonstrated. Compared to point-by-point scanning, our method increases the fabrication throughput by orders of magnitude, paving the way for adopting MPP for mass production of functional devices in many industrial applications.

Conference Presentation

Citation Download Citation

He Cheng, Pooria Golvari, Chun Xia, Mingman Sun, Meng Zhang, Stephen M. Kuebler, and Xiaoming Yu "Volumetric microfabrication of helical structures for industrial applications", Proc. SPIE 12054, Novel Patterning Technologies 2022, 1205409 (25 May 2022); https://doi.org/10.1117/12.2614703

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