Impacts of process flow, scaling, and variability on interconnect performance

K. Egelhofer Ruegger; P. Nanja; M. Hargrove

doi:10.1117/12.2612591

25 May 2022 Impacts of process flow, scaling, and variability on interconnect performance

K. Egelhofer Ruegger, P. Nanja, M. Hargrove

Proceedings Volume 12055, Advances in Patterning Materials and Processes XXXIX; 120550L (2022) https://doi.org/10.1117/12.2612591
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States

Abstract

Virtual fabrication is used to evaluate the performance of interconnects (line and via resistance, capacitance, etc.) across pitches compatible with either EUV single exposure or SADP for three different process flows: single damascene, dual damascene, and semi-damascene (subtractive metal etch). The effects of process variation for the three flows are also investigated to determine the relative importance of process flow, variation, and scaling when moving toward aggressive pitch interconnects.

Conference Presentation

Citation Download Citation

K. Egelhofer Ruegger, P. Nanja, and M. Hargrove "Impacts of process flow, scaling, and variability on interconnect performance", Proc. SPIE 12055, Advances in Patterning Materials and Processes XXXIX, 120550L (25 May 2022); https://doi.org/10.1117/12.2612591

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