Design of virtual and real system of assembly platform based on digital twin

Xinghua Wang; Zhenyu Wang; Guangtao Wang; Xiaohong Liu

doi:10.1117/12.2673433

3 April 2023 Design of virtual and real system of assembly platform based on digital twin

Xinghua Wang, Zhenyu Wang, Guangtao Wang, Xiaohong Liu

Proceedings Volume 12599, Second International Conference on Digital Society and Intelligent Systems (DSInS 2022); 125990S (2023) https://doi.org/10.1117/12.2673433
Event: 2nd International Conference on Digital Society and Intelligent Systems (DSInS 2022), 2022, Chendgu, China

Abstract

The debugging quality in the debugging stage of the digital production line directly affects its processing accuracy. Due to the rich and varied production scenes and complex equipment associations, the general production debugging plan has a long cycle. Therefore, this paper adopts digital twin technology to apply to the traditional assembly system design process, adopts NX, MCD, TIA and other design methods. Firstly, builds a digital virtual model of the assembly platform; Secondly, the application of electromechanical concept design module to achieve virtual simulation of the assembly process; In the TIA project environment, the logic control program of the PLC controller is written; Then, build a physical system based on a virtual model; Finally, virtual and real system integration is achieved through communication connections. The research results show that the traditional assembly system from design, debugging and application cost is higher, cycles are usually within three to five months, assembly platform based on the digital twin technology can significantly reduce the design cycle of assembly system and research and development costs.

Citation Download Citation

Xinghua Wang, Zhenyu Wang, Guangtao Wang, and Xiaohong Liu "Design of virtual and real system of assembly platform based on digital twin", Proc. SPIE 12599, Second International Conference on Digital Society and Intelligent Systems (DSInS 2022), 125990S (3 April 2023); https://doi.org/10.1117/12.2673433

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