Paper
10 October 2023 Layout optimization and signal integrity analysis of high-speed differential via
Lusha Zhou, Guangfu Liu, Aijing Zeng, Yifu Ding, Zhe Liu, Haijun She
Author Affiliations +
Proceedings Volume 12799, Third International Conference on Advanced Algorithms and Signal Image Processing (AASIP 2023); 127992U (2023) https://doi.org/10.1117/12.3006126
Event: 3rd International Conference on Advanced Algorithms and Signal Image Processing (AASIP 2023), 2023, Kuala Lumpur, Malaysia
Abstract
With the rapid development of automobiles towards electrification and intelligence, 5nm Qualcomm 8295 flagship chip has been gradually applied to traditional and new energy vehicles, which brings higher requirements for high-quality signal transmission. In this study, the signal quality evaluation methods of the insertion loss to crosstalk ratio and the integrated crosstalk noise are explored. In addition, two kinds of differential via optimization schemes with the signal-ground ratio of 1:2 and 2:3 are proposed, respectively. The results show that the performance of the new differential via structure is improved significantly, which provides a reliable solution for high-quality signal transmission.
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Lusha Zhou, Guangfu Liu, Aijing Zeng, Yifu Ding, Zhe Liu, and Haijun She "Layout optimization and signal integrity analysis of high-speed differential via", Proc. SPIE 12799, Third International Conference on Advanced Algorithms and Signal Image Processing (AASIP 2023), 127992U (10 October 2023); https://doi.org/10.1117/12.3006126
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KEYWORDS
Crosstalk

Optical character recognition

Fourier transforms

Signal attenuation

Signal analyzers

Data transmission

Interference (communication)

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