Poster + Paper
12 March 2024 Microfabrication of polyimide film by helium-free short-pulse CO2 laser
Ryo Okawa, Kazuyuki Uno, Shohei Watarai, Yasushi Kodama
Author Affiliations +
Conference Poster
Abstract
Piercing and cutting of polyimide film were investigated by our He-free CO2 laser excited by longitudinal pulsed discharge without pre-ionization. The samples were polyimide film with a thickness of 50 μm, 100 μm, 150 μm and 200 μm. The laser pulse was a short pulse with a tail and had a laser energy of 39.6 mJ, a spike pulse width of 384 ns, a tail length of 108 μs, and an energy ratio of the spike pulse to the pulse tail of 1:128 at a repetition rate of 200 Hz. The laser beam was circular flat-top shape. The laser beam was focused to a diameter of 508 μm, with a fluence per pulse of 19.4 J/cm2. The minimum total irradiation fluence required for piercing in the film with a thickness of 200 μm was 389 J/cm2. The minimum scanning speed required for cutting in the film with a thickness of 200 μm was 15 mm/s.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Ryo Okawa, Kazuyuki Uno, Shohei Watarai, and Yasushi Kodama "Microfabrication of polyimide film by helium-free short-pulse CO2 laser", Proc. SPIE 12873, Laser-based Micro- and Nanoprocessing XVIII, 1287315 (12 March 2024); https://doi.org/10.1117/12.3001366
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KEYWORDS
Gas lasers

Beam diameter

Film thickness

Polyimides

Laser cutting

Pulsed laser operation

Laser irradiation

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