Laser sintering of various film compositions used in flexible hybrid electronics

Ellie Schlake; Nirmala Kandadai

doi:10.1117/12.3004843

12 March 2024 Laser sintering of various film compositions used in flexible hybrid electronics

Ellie Schlake, Nirmala Kandadai

Proceedings Volume 12873, Laser-based Micro- and Nanoprocessing XVIII; 1287318 (2024) https://doi.org/10.1117/12.3004843
Event: SPIE LASE, 2024, San Francisco, California, United States

Conference Poster

Abstract

The fabrication of flexible hybrid electronics involves depositing ink onto a substrate using micro-dispensing techniques, including direct ink write processes. In most cases, the ink comprises solvents, binders, and nanoparticle material. To achieve the desired printed film characteristics, the deposited ink must be treated to evaporate the solvents and binders and melt, or sinter, the nanoparticles to form a continuous film. Laser sintering is a method for achieving this process for flexible hybrid electronic production. An incident laser beam is directed onto the printed film’s surface to sinter the particles rather than alternative thermal processes. The laser sintering parameters vary with the ink film composition, substrate, and film thickness. This study uses different laser systems, film compositions, and substrates to achieve the optimal laser sintering parameters for the desired application. The inks studied include silver, doped barium titanate, and silver-palladium on glass, polyimide, and alumina substrates. This work aims to develop sintering parameters for flexible hybrid electronics fabrication on the International Space Station.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Ellie Schlake and Nirmala Kandadai "Laser sintering of various film compositions used in flexible hybrid electronics", Proc. SPIE 12873, Laser-based Micro- and Nanoprocessing XVIII, 1287318 (12 March 2024); https://doi.org/10.1117/12.3004843

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