Presentation + Paper
4 October 2024 Simulation and fabrication of a high aspect ratio embedded point-like transmission target
Author Affiliations +
Abstract
In this study, we address the challenge of enhancing image quality and spatial resolution in computed tomography (CT) imaging by introducing simulation and fabrication of high aspect ratio, point-like transmission targets. Utilizing advanced electroplating techniques, traditionally employed in the fabrication of Through Substrate Via (TSV) interconnects for CMOS circuitry, we successfully embed copper targets within silicon substrates. This method allows us to create high-aspect- ratio features specifically designed for x-ray transmission targets, resulting in micro targets that exhibit a volume increase compared to conventional evaporated surface targets. Furthermore, we present simulation results of the x-ray spectrum generated by these targets, demonstrating their potential to significantly improve both image quality and spatial resolution in CT applications. Our findings suggest that leveraging advanced fabrication techniques can open new avenues for the development of enhanced imaging technologies in medical diagnostics and beyond.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Gabriella Dalton, Courtney L. H. Sovinec, Matthew B. Jordan, Nhi Y. Le, Edward S. Jimenez, and Noelle Collins "Simulation and fabrication of a high aspect ratio embedded point-like transmission target", Proc. SPIE 13150, Advances in X-Ray/EUV Optics and Components XIX, 131500C (4 October 2024); https://doi.org/10.1117/12.3027094
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Fabrication

X-rays

Monte Carlo methods

Copper

Device simulation

Silicon

Design

RELATED CONTENT


Back to Top