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26 August 2024 Throughput simulations of the two-mask stage for high-NA EUV scanners
Kiwamu Takehisa
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Proceedings Volume 13177, Photomask Japan 2024: XXX Symposium on Photomask and Next-Generation Lithography Mask Technology; 131770H (2024) https://doi.org/10.1117/12.3031845
Event: Photomask Japan 2024, 2024, Yokohama, Japan
Abstract
Since high-NA EUV scanners have a half field size, two masks are necessary for exposing a large device which is larger than the half field of 26 mm x 16.5 mm. However, it takes long time until exposing the 2nd half field since the 2nd mask would be loaded after exposing the 1st half fields on many wafers. This may cause poor characteristics at the stitching area. Recently, we have proposed a new idea which is based on a two-mask stage with a new scan method. This can drastically reduce the time until exposing the 2nd half field. Moreover, according to our scanner throughput simulation, the two-mask stage has ~1.5 times higher throughput than the single-mask stage. Although, the throughput is still ~75 % of that of a 6” x 12” mask scanner, it can be improved to ~90 %.
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Kiwamu Takehisa "Throughput simulations of the two-mask stage for high-NA EUV scanners", Proc. SPIE 13177, Photomask Japan 2024: XXX Symposium on Photomask and Next-Generation Lithography Mask Technology, 131770H (26 August 2024); https://doi.org/10.1117/12.3031845
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KEYWORDS
Scanners
Photomasks
Semiconducting wafers
Simulations
Extreme ultraviolet lithography
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