Paper
27 September 2024 Molecular dynamics simulation of the effect of temperature on the nanoindentation process of monocrystalline Si
Zhengzhao Li, Jianguo Cao, Qinjian Zhang
Author Affiliations +
Proceedings Volume 13261, Tenth International Conference on Mechanical Engineering, Materials, and Automation Technology (MMEAT 2024); 1326116 (2024) https://doi.org/10.1117/12.3046737
Event: 10th International Conference on Mechanical Engineering, Materials, and Automation Technology (MMEAT 2024), 2024, Wuhan, China
Abstract
With the help of molecular dynamics simulation, the model of monocrystalline Si workpiece and diamond indenter was established at the micro and nano scale, and the nanoindentation simulation at different temperatures was carried out to obtain the load displacement curve (P-h) at different temperatures, and then the influence of temperature change from 10k to 300K on the performance of silicon was explored. It is found that the lower the temperature, the higher the corresponding P-h curve, and the farther away from the origin is the intersection point of the unloading part of the P-h curve from the X-axis. At higher temperatures, the atomic spacing increases, and the atomic interaction force inside the Si is small, resulting in a small elastic recovery of the material, which ultimately makes the plastic indentation depth of Si.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Zhengzhao Li, Jianguo Cao, and Qinjian Zhang "Molecular dynamics simulation of the effect of temperature on the nanoindentation process of monocrystalline Si", Proc. SPIE 13261, Tenth International Conference on Mechanical Engineering, Materials, and Automation Technology (MMEAT 2024), 1326116 (27 September 2024); https://doi.org/10.1117/12.3046737
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KEYWORDS
Silicon

Chemical species

Materials properties

Diamond

Deformation

Plastics

Crystals

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