Paper
1 July 1991 Evaluation of a photoresist process for 0.75-micron g-line lithography
Jack S. Kasahara, Mircea V. Dusa, Thiloma Perera
Author Affiliations +
Abstract
A consistent 0.75 micron lithography process was developed for implementation in an existing technology environment. Prolith/2 modeling parameters were experimentally measured and photoresist simulations were performed to gain confidence in the modeling program. Experimental results fulfilled a proposed set of production process requirements, and a consistent three-quarter-micron, g-line process can be implemented in the manufacturing environment.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jack S. Kasahara, Mircea V. Dusa, and Thiloma Perera "Evaluation of a photoresist process for 0.75-micron g-line lithography", Proc. SPIE 1463, Optical/Laser Microlithography IV, (1 July 1991); https://doi.org/10.1117/12.44809
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Cited by 4 scholarly publications.
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KEYWORDS
Silicon

Photoresist materials

Lithography

Photoresist developing

Oxides

Scanning electron microscopy

Thin films

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