Microchannel heatsink with liquid-nitrogen cooling

Robert A. Riddle; Anthony F. Bernhardt

doi:10.1117/12.140527

25 February 1993 Microchannel heatsink with liquid-nitrogen cooling

Robert A. Riddle, Anthony F. Bernhardt

Proceedings Volume 1739, High Heat Flux Engineering; (1993) https://doi.org/10.1117/12.140527
Event: San Diego '92, 1992, San Diego, CA, United States

Abstract

Excellent thermal performance of a silicon microchannel heatsink is demonstrated using liquid nitrogen as the coolant over a wide range of heat loads up to 1 kW/cm². This performance is partly due to the order of magnitude increase in the thermal conductivity of silicon near 77 degree(s)K compared to room temperature. Subcooled boiling of the liquid nitrogen in the microchannel heatsink further enhances the thermal performance but makes the thermal resistance a nonlinear function of heat load. For a 500 W/cm² heat load, a thermal resistance of 0.052 cm^2*0C/W for a 9:1 aspect ratio heatsink was measured.

Citation Download Citation

Robert A. Riddle and Anthony F. Bernhardt "Microchannel heatsink with liquid-nitrogen cooling", Proc. SPIE 1739, High Heat Flux Engineering, (25 February 1993); https://doi.org/10.1117/12.140527

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