Dual exposure (e-beam and i-line) of OCG-895i resist

Richard J. Bojko; Graham M. Pugh

doi:10.1117/12.146507

24 June 1993 Dual exposure (e-beam and i-line) of OCG-895i resist

Richard J. Bojko, Graham M. Pugh

Proceedings Volume 1924, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing III; (1993) https://doi.org/10.1117/12.146507
Event: SPIE'S 1993 Symposium on Microlithography, 1993, San Jose, CA, United States

Abstract

A process is described in which OCG-895i resist is exposed using both e-beam and i-line optical exposures. This dual exposure allows efficient writing of patterns requiring both fine geometries and large areas in a single lithographic layer. The unique aspect of this process is that the two exposure methods use completely independent developers. This allows the optical exposures to be aligned directly to the e-beam exposed resist, eliminating the need for 'zero- level' alignment marks. E-beam features as small as 200 nm lines and spaces, connected by large photo-exposed pads, have been fabricated. The process presented here results in e-beam contrast of 4.8, with insignificant unexposed film loss. The photo-exposure characteristics are unchanged by the e-beam exposure and develop process. The application of this process to the fabrication of surface acoustic wave devices is discussed.

Citation Download Citation

Richard J. Bojko and Graham M. Pugh "Dual exposure (e-beam and i-line) of OCG-895i resist", Proc. SPIE 1924, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing III, (24 June 1993); https://doi.org/10.1117/12.146507

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