New methodology of optimizing optical overlay measurement

Yasushi Tanaka; Masayuki Kamiya; Norio Suzuki

doi:10.1117/12.148968

4 August 1993 New methodology of optimizing optical overlay measurement

Yasushi Tanaka, Masayuki Kamiya, Norio Suzuki

Proceedings Volume 1926, Integrated Circuit Metrology, Inspection, and Process Control VII; (1993) https://doi.org/10.1117/12.148968
Event: SPIE'S 1993 Symposium on Microlithography, 1993, San Jose, CA, United States

Abstract

For achieving more accurate overlay measurement of optical metrology system, this paper shows a new approach from the viewpoint of measured data correlation between before and after etching. From this comparison, two new methodologies are proposed. One method does not require measurement after etching to optimize measurement algorithms. The superiority of this approach is also discussed compared to the criteria of measurement repeatability and TIS. Using the new methodologies, measurement algorithms are optimized for many kinds of processed wafers, including high temperature sputtered aluminum, with a grainier surface than conventionally sputtered aluminum.

Citation Download Citation

Yasushi Tanaka, Masayuki Kamiya, and Norio Suzuki "New methodology of optimizing optical overlay measurement", Proc. SPIE 1926, Integrated Circuit Metrology, Inspection, and Process Control VII, (4 August 1993); https://doi.org/10.1117/12.148968

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