Paper
10 June 1994 Integrated optoelectronic interconnect for phased-array antenna applications
Lawrence J. Lembo, Moshe Sergant, Chan A. Tu, Philip H. Wisseman, Charles Zmudzinski, John C. Brock
Author Affiliations +
Abstract
An integrated semiconductor interconnect chip is being developed for the distribution of microwave signals to the subarrays and/or radiating elements of a phased array antenna (PAA). The baseline chip design calls for a 1 X 4 distribution fanout, and consists of both waveguide splitters and integrated optical amplifiers to compensate for inherent splitting as well as excess waveguide and coupling losses. Analysis is being performed to evaluate the RF performance of photonic links containing semiconductor optical amplifiers, and to determine the most judicious use of such an interconnect in the photonic feed network of a PAA.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lawrence J. Lembo, Moshe Sergant, Chan A. Tu, Philip H. Wisseman, Charles Zmudzinski, and John C. Brock "Integrated optoelectronic interconnect for phased-array antenna applications", Proc. SPIE 2155, Optoelectronic Signal Processing for Phased-Array Antennas IV, (10 June 1994); https://doi.org/10.1117/12.177387
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KEYWORDS
Antennas

Optoelectronics

Waveguides

Integrated optics

Microwave radiation

Optical amplifiers

Phased arrays

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