Unique 3D architecture for high-resolution imaging

David E. Ludwig; J. Arnold

doi:10.1117/12.178485

23 June 1994 Unique 3D architecture for high-resolution imaging

David E. Ludwig, J. Arnold

Proceedings Volume 2226, Infrared Readout Electronics II; (1994) https://doi.org/10.1117/12.178485
Event: SPIE's International Symposium on Optical Engineering and Photonics in Aerospace Sensing, 1994, Orlando, FL, United States

Abstract

Visible and infrared focal planes are becoming ever larger and more complicated, but the real estate for unit cell electronics is diminishing. Applications such as High Definition Television require very large format focal plane arrays and complex post image processing prior to data transmission. The authors describe in this paper a technique of combining an active pixel CMOS sensor, or a CCD image capture device with analog to digital conversion and data compression circuitry on the focal plane in a unique Z-technology architecture. This architecture incorporates a stack of signal processing integrated circuits physically connected below the image capture device which provides up to 10 times the unit cell electronics real estate for the data conditioning. This paper focuses on the interconnect techniques between the image capture device and the post processing electronics.

Citation Download Citation

David E. Ludwig and J. Arnold "Unique 3D architecture for high-resolution imaging", Proc. SPIE 2226, Infrared Readout Electronics II, (23 June 1994); https://doi.org/10.1117/12.178485

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