Automated radiometric cryoprobe of IR focal plane array wafers

Stephen L. Whicker

doi:10.1117/12.179669

13 July 1994 Automated radiometric cryoprobe of IR focal plane array wafers

Stephen L. Whicker

Proceedings Volume 2228, Producibility of II-VI Materials and Devices; (1994) https://doi.org/10.1117/12.179669
Event: SPIE's International Symposium on Optical Engineering and Photonics in Aerospace Sensing, 1994, Orlando, FL, United States

Abstract

Texas Instruments (TI) validated the feasibility of cryoprobing IRFPA arrays in late 1991. Since then, TI has developed a revolutionary automated cryoprobe for screening four and six inch wafers of IRFPAs. Generic prober automation features include cassette to cassette wafer load and unload, wafer alignment, black body selection, aperture selection, probe tip continuity test, and 77.5 degree(s) to 400 degree(s)K wafer temperature control. Modular construction of the prober enables placement of product specific components such as MWIR or LWIR bandpass filters, coldshield, coldfilter, probe card, and noise suppression circuitry on an easily removable `product specific' tooling plate. Prober operation is controlled through object oriented software. IRFPA specific software modules control array operation, data collection, and data reduction. In addition to describing the prober capabilities and versatility, this paper compares prober test data to lab dewar test data for 240 X 1 IRFPAs and projects benefits in reduced cycle time and labor savings.

Citation Download Citation

Stephen L. Whicker "Automated radiometric cryoprobe of IR focal plane array wafers", Proc. SPIE 2228, Producibility of II-VI Materials and Devices, (13 July 1994); https://doi.org/10.1117/12.179669

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KEYWORDS

Semiconducting wafers

Staring arrays

Bandpass filters

Black bodies

Long wavelength infrared

Mid-IR

Optical alignment

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