Isolation of novolak resin at low temperature

M. Dalil Rahman; Daniel P. Aubin; Dinesh N. Khanna

doi:10.1117/12.241853

14 June 1996 Isolation of novolak resin at low temperature

M. Dalil Rahman, Daniel P. Aubin, Dinesh N. Khanna

Author Affiliations +

Proceedings Volume 2724, Advances in Resist Technology and Processing XIII; (1996) https://doi.org/10.1117/12.241853
Event: SPIE's 1996 International Symposium on Microlithography, 1996, Santa Clara, CA, United States

Abstract

It is a well known fact that novolak resin undergoes chemical structure changes using vigorous synthesis conditions, such as under high acid catalyst loading and high temperature during isolation. Under such conditions, the structure of novolak resin is rearranged through quinone methide intermediate. We have also observed that the rearranged novolak resin does not perform well in photolithography. In this paper we discus the alternate isolation procedure, eliminating high temperature vacuum distillation. In this process a typical resin synthesis is performed using cresylic acids, catalyst and a solvent with the addition of formaldehyde over time. At the end of the condensation period, distillation is applied using a sub-surface high forced steam. Distillation is performed until all the unreacted cresols are removed. At this point the temperature is raised up to 140 degrees Celsius, and the vacuum is slowly drawn to 35 mm Hg to remove residual water. After the volatiles have been distilled off, the vacuum is released and a solvent is added to adjust the solid content. We discuss in this paper, the properties of the resin in the application of photolithography.

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M. Dalil Rahman, Daniel P. Aubin, and Dinesh N. Khanna "Isolation of novolak resin at low temperature", Proc. SPIE 2724, Advances in Resist Technology and Processing XIII, (14 June 1996); https://doi.org/10.1117/12.241853

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