Spectroscopic multilayer film thickness measurement system

Masahiro Horie; Nariaki Fujiwara; Masahiko Kokubo; Hiroshi Kakiuchida

doi:10.1117/12.240125

21 May 1996 Spectroscopic multilayer film thickness measurement system

Masahiro Horie, Nariaki Fujiwara, Masahiko Kokubo, Hiroshi Kakiuchida

Proceedings Volume 2725, Metrology, Inspection, and Process Control for Microlithography X; (1996) https://doi.org/10.1117/12.240125
Event: SPIE's 1996 International Symposium on Microlithography, 1996, Santa Clara, CA, United States

Abstract

Accurate film thickness controls are indispensable for manufacturing defect-free semiconductor devices. Moreover, recent high integration requires simultaneous measurement of each film thickness and optical constants in multi-layers. This paper explains a microspectroscopic film thickness measurement system that measures film thickness at a very small spot (several micrometers in diameter) in several angstrom increments. This system also enables the user to measure film thickness on bulk wafers and SOI wafers, and determine optical constants of unknown films.

Citation Download Citation

Masahiro Horie, Nariaki Fujiwara, Masahiko Kokubo, and Hiroshi Kakiuchida "Spectroscopic multilayer film thickness measurement system", Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996); https://doi.org/10.1117/12.240125

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