Packaging issues related to network access modules

Cecile Dreze

doi:10.1117/12.265368

30 January 1997 Packaging issues related to network access modules

Cecile Dreze

Proceedings Volume 2918, Emerging Components and Technologies for All-Optical Photonic Systems II; (1997) https://doi.org/10.1117/12.265368
Event: Photonics East '96, 1996, Boston, MA, United States

Abstract

WDM networks offer potentially increased bandwidth and functionality when compared to single wavelength ones, with applications ranging from straightforward capacity enhancement through to switched virtual dark fiber carrying disparate traffic to the customers' premises. However, to be implemented in the ground, these optical networks have to offer cost effective solutions to the users. This means that WDM equipment must be built small, rugged with low power consumption and high functional density. The NAM (network access module) developed by the ONTC, makes extensive use of array electronics, optoelectronics and optoelectronic integrated circuits (OEICs) and illustrates such system integration. But high level integration and high functional density bring new challenges in packaging together with the difficulty of managing crosstalk. In this paper we describe the network access module, detail some of the key packaging technologies and discuss alternative integration approaches which are explored as part of another collaboration project called Rozinante. To conclude, some applications using the NAM are proposed which show the key role of this network element in building reconfigurable optical networks.

Citation Download Citation

Cecile Dreze "Packaging issues related to network access modules", Proc. SPIE 2918, Emerging Components and Technologies for All-Optical Photonic Systems II, (30 January 1997); https://doi.org/10.1117/12.265368

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