Advanced inspection for 0.25-um-generation semiconductor manufacturing

Arye Shapiro; Thomas James; Brian M. Trafas

doi:10.1117/12.275937

7 July 1997 Advanced inspection for 0.25-μm-generation semiconductor manufacturing

Arye Shapiro, Thomas James, Brian M. Trafas

Proceedings Volume 3050, Metrology, Inspection, and Process Control for Microlithography XI; (1997) https://doi.org/10.1117/12.275937
Event: Microlithography '97, 1997, Santa Clara, CA, United States

Abstract

The goal of SEMATECH Joint Development Project J101 was to accelerate the development of a patterned wafer inspection tool to meet the sensitivity, throughput, and cost requirements for 0.25 micrometers and 0.18 micrometers technology generations. To accomplish this goal, SEMATECH partnered with Tencor Instruments to develop the Tencor Surfscan Advanced Inspection Tool (AIT). This tool is capable of inspecting 100-200 mm wafers with random and repetitive patterns for both particulate contamination and pattern defects. This capability, combined with its high throughput, makes the Surfscan AIT useful as an in-line process monitor. In order to determine its performance on product wafers in a manufacturing environment, a beta version of the AIT system was evaluate at Advanced Micron Devices Fab 25, in Austin, Texas. The evaluation was conducted according to the SEMATECH qualification plan. The final tool development, IRONMAN testing, and beta site evaluation will be described in this paper.

Citation Download Citation

Arye Shapiro, Thomas James, and Brian M. Trafas "Advanced inspection for 0.25-μm-generation semiconductor manufacturing", Proc. SPIE 3050, Metrology, Inspection, and Process Control for Microlithography XI, (7 July 1997); https://doi.org/10.1117/12.275937

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