Novolak resin for ultrafast high-resolution positive i-line photoresist compositions

M. Dalil Rahman; Ping-Hung Lu; Michelle M. Cook; Woo-Kyu Kim; Dinesh N. Khanna

doi:10.1117/12.312347

29 June 1998 Novolak resin for ultrafast high-resolution positive i-line photoresist compositions

M. Dalil Rahman, Ping-Hung Lu, Michelle M. Cook, Woo-Kyu Kim, Dinesh N. Khanna

Author Affiliations +

Proceedings Volume 3333, Advances in Resist Technology and Processing XV; (1998) https://doi.org/10.1117/12.312347
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

An improved process for isolation of novolak resins from phenol-formaldehyde condensation products has been developed. The process results in resins having low polydispersity and higher photospeed while typical phenol/formaldehyde resin syntheses generate a broad distribution of molecular weight fragments with a wide polydispersity. The novolak resins were characterized by NMR and GPC and were formulated to obtain ultra fast high resolution i-line photoresists. The characteristics of the resins and their effect on lithographic properties as i-line photoresist compositions will be discussed in this paper.

Citation Download Citation

M. Dalil Rahman, Ping-Hung Lu, Michelle M. Cook, Woo-Kyu Kim, and Dinesh N. Khanna "Novolak resin for ultrafast high-resolution positive i-line photoresist compositions", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); https://doi.org/10.1117/12.312347

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