Defect inspection on CMP process and its application

Minori N. Noguchi; Yoshimasa Oshima; Hidetoshi Nishiyama; Kenji Watanabe; Aritoshi Sugimoto

doi:10.1117/12.350865

14 June 1999 Defect inspection on CMP process and its application

Minori N. Noguchi, Yoshimasa Oshima, Hidetoshi Nishiyama, Kenji Watanabe, Aritoshi Sugimoto

Author Affiliations +

Proceedings Volume 3677, Metrology, Inspection, and Process Control for Microlithography XIII; (1999) https://doi.org/10.1117/12.350865
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

A high-throughput high-sensitivity defect-detection technique has been developed for manufacturing 0.15-0.25- micrometers LSI devices. It incorporates a high-resolution detection systems using multi-channel detectors and a high- resolution imaging system using spatial filtering and collimated focused-beam illumination. A new algorithm called correlated local area statistical threshold enables this technique to achieve a sensitivity of 0.15 micrometers on front- end processes and 0.3 micrometers on back-end processes and a high throughput.

Citation Download Citation

Minori N. Noguchi, Yoshimasa Oshima, Hidetoshi Nishiyama, Kenji Watanabe, and Aritoshi Sugimoto "Defect inspection on CMP process and its application", Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); https://doi.org/10.1117/12.350865

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE