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This paper presents the design, fabrication, modeling, and testing of several Flexure-Beam Micromirror Device (FBMD) arrays fabricated using flip-chip assembly. These arrays were prefabricated using a silicon surface-micromachining technology and then transferred to a ceramic receiving substrate using a thin layer of indium placed between the bond pads of the two chips. Device characterization was completed using an interferometric microscope in which micromirror deflection was determined as a function of address potential. The arrays demonstrate reasonable micromirror performance with optically flat surfaces measuring only 5 - 6 nm of variance across as much as a 150 micrometer mirror surface.
M. Adrian Michalicek,Wenge Zhang,Kevin F. Harsh,Victor M. Bright, andY. C. Lee
"Micromirror arrays fabricated by flip-chip assembly", Proc. SPIE 3878, Miniaturized Systems with Micro-Optics and MEMS, (2 September 1999); https://doi.org/10.1117/12.361291
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M. Adrian Michalicek, Wenge Zhang, Kevin F. Harsh, Victor M. Bright, Y. C. Lee, "Micromirror arrays fabricated by flip-chip assembly," Proc. SPIE 3878, Miniaturized Systems with Micro-Optics and MEMS, (2 September 1999); https://doi.org/10.1117/12.361291