Experimental study of micro-EDM machining performances on silicon wafer

Xiaozhong Song; Wim Meeusen; Dominiek Reynaerts; Hendrik Van Brussel

doi:10.1117/12.396450

25 August 2000 Experimental study of micro-EDM machining performances on silicon wafer

Xiaozhong Song, Wim Meeusen, Dominiek Reynaerts, Hendrik Van Brussel

Author Affiliations +

Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396450
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States

Abstract

The micro-EDM silicon machining performances have been stud on a highly doped P-type silicon wafer. To demonstrate and to emphasize the silicon micro-EDM, one kind of stainless steel is machine das a reference material. Both materials are sparked with specific sparking energy in micro-Joule energy range and machining characteristics such as material removal mechanism, cutting rate, relative electrode wear ratio and surface quality are examined and analyzed. The thermally induced microcracks are also examined and analyzed using a an optical and a SEM. It is found that for silicon, the micro-EDM material removal mechanism is not completely similar to conventional metal micro-EDM; besides melting and evaporation there is a significant contribution from thermal spallation, which is a kind of direct mechanical material damage without melting. This paper also present that microcrack generation is not only relate to the sparking energy but also has a close relationship with the silicon crystal lattice. In order to get microcrack free silicon surfaces, the sparking energy should be controlled to low levels, which are much lower than the voltage levels used in metal micro-EDM. All in all, thermal spalling should be reduced as much as possible, to obtain smooth and crack free machined surfaces.

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Xiaozhong Song, Wim Meeusen, Dominiek Reynaerts, and Hendrik Van Brussel "Experimental study of micro-EDM machining performances on silicon wafer", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396450

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