Surface preparation for selective tungsten deposition on MEMS structures

Paul J. Resnick; Seethambal S. Mani

doi:10.1117/12.443010

2 October 2001 Surface preparation for selective tungsten deposition on MEMS structures

Paul J. Resnick, Seethambal S. Mani

Proceedings Volume 4558, Reliability, Testing, and Characterization of MEMS/MOEMS; (2001) https://doi.org/10.1117/12.443010
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States

Abstract

Selectively deposited tungsten films on MEMS surfaces that are subject to friction and wear can substantially reduce wear-related failures. Because deposition of the tungsten film is highly selective to silicon, a pristine surface is required to obtain high quality, contiguous films. Vapor phase HF was used to remove the thin chemical oxide that resides on the surface following traditional liquid phase dissolution of sacrificial oxide films and supercritical CO₂ drying of MEMS devices. The use of vapor phase HF after mechanical parts have been released, rather than liquid processes, mitigates potential device damage and surface tension-induced stiction that may occur during liquid phase processing. Tungsten film thickness and morphology were identical to films that were obtained through the use of liquid phase pre-cleaning processes.

Citation Download Citation

Paul J. Resnick and Seethambal S. Mani "Surface preparation for selective tungsten deposition on MEMS structures", Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); https://doi.org/10.1117/12.443010

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