Packaging of the rf MEMS switch

Heung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Byeong-Kwon Ju

doi:10.1117/12.448864

19 November 2001 Packaging of the rf MEMS switch

Heung-Woo Park, Yun-Kwon Park, Duck-Jung Lee, Byeong-Kwon Ju

Proceedings Volume 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II; (2001) https://doi.org/10.1117/12.448864
Event: International Symposium on Microelectronics and MEMS, 2001, Adelaide, Australia

Abstract

In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250 micrometers diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within -0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

Citation Download Citation

Heung-Woo Park, Yun-Kwon Park, Duck-Jung Lee, and Byeong-Kwon Ju "Packaging of the rf MEMS switch", Proc. SPIE 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II, (19 November 2001); https://doi.org/10.1117/12.448864

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available